When equipped with tweezers, bond testers may also perform cold bump pull tests.
2.
Modern bond testers can perform a wide variety of tests with high precision, because automation eliminates human influence on the measurement.
3.
The term wire pull usually refers to the act of pulling a wire with a hook mounted on a pull sensor on a bond tester.
4.
However, to promote certain failure modes, wires can be cut and then pulled by tweezers, also mounted on a pull sensor on a bond tester.
5.
The most common test types performed on a bond tester are the wire pull test, which generally puts an upward force on a gold / aluminum / silver / copper wire, and the die shear test, which generally comprises loading a die from the side.